Description
Repairs and seals holes in all rigid substrates within 20 seconds using a two-part bond.
Applications
Ideal for repairs on all rigid substrates including, but not limited to, the following:
- Aluminum
- Copper
- Brass
- Steel
- Stainless Steel
- Black Iron
- Galvanized
- PVC
- PEX
- CPVC
Do not use on flexible substrates like canvas, rubber or cardboard.
How to Use
Prepare: Wipe area clean so it is free of oils, refrigerant, etc. with acetone and ensure there is no pressure on the system.
Sand: Sand the area around the hole down for sealant application.
Apply: Apply Bonding Fluid (A) to the repair area.
Coat: Coat Bonding Cells (B) on top of (A).
Apply: Apply Bonding Fluid (A) on top of (B).
Cure: Bonds are cured after 20 minutes.
Clean: For cleaning, wipe acetone over repair area.
For large holes: Repeat as needed to fully cover the hole, following the above steps.
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